Summary of Accomplishments:



	Led a newly formed team of 16 people to start up a new Flip Chip production line / capability for China plant, managed to planned, hiring, setup and qualified the new line within 6 months time; which is 3 months ahead of schedule and ramped the volume from 0 to 300k/month and subsequently increase to 5 million / month.  

	Successfully launched  product  in time and secured USD16 Million revenue close to quarter end

	Successfully patented 7 designs/concepts and written 35 internal and external papers in IDF, IMEC, IEMT, EMAP, IEEE and SEMI.

	Led 4 teams consist of 15 people across the globe on a mutual project. Successfully brought all the teams together and ensuring each functional group within the team meeting each group¡¯s different requirements while ensuring the project successions rate.  

	Successfully brought a project from development to market launch within the planned period; making full use of the limited resources and time. With this launched, we had brought in USD$16M for the quarter and being the only project that had successfully launched for that quarter.

	Led a team of 18 people to work on GPTW (Great Place To Work) activities. Successfully brought up the team performance to a level where our works were being recognized and benchmarked by other groups globally and activities been published in the newspapers.    

	Involved in EMAP (6th International Conference on Electronic Materials and Packaging) as organizing technical committee member to review and ensure the conference being executed flawlessly in Penang. 

	Successfully invented / developed multi purpose equipment / metrology tool for wafer processing / assembly which save USD500k.

	Successfully led several team across Intel site (Philippine, Costa Rica, Pudong, US and Malaysia) on resolving issue, factory start-up, cross learning as well as achieving CE (copy exactly) across all sites.

	Initiated several major cost saving project across Intel Processor Manufacturing sites, which contributed to nearly USD$10M.    

	Successfully developed and implemented web base engineering course for worldwide Intel engineers. This has enabled real time sharing (visual and audio) across different continent as well as information sharing through one source.